Method of forming a housing component
US8220142B2 · kind B2 · utility
6Cited by
2References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Sep 29, 2008 |
| Grant date | Jul 17, 2012 |
| Priority date | — |
| Expiry date | Oct 24, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Electronic devices are provided with housing components that have improved aesthetics. One or more holes may be formed through a portion of the housing and then the housing portion may be anodized. The anodization process may increase or decrease the geometries of each hole. The holes may be formed through the housing portion from a cosmetic side of the housing portion to an interior side of the housing portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.