Heat dissipation device
US8220528B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 3, 2009 |
| Grant date | Jul 17, 2012 |
| Priority date | — |
| Expiry date | Feb 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device for cooling an electronic device mounted on a printed circuited board, comprises a heat spreader contacting the electronic device, a fin assembly comprising a plurality of fins, a supporting bracket contacting the heat spreader and supporting the fin assembly, and a heat pipe extending through the fin assembly and the supporting bracket and attached to the heat spreader, wherein a lowermost fin of the fin assembly has a plurality of clasps extending near two opposite ends thereof and towards the supporting bracket. The clasps are bent to press against a bottom of the supporting bracket after the clasps extend through the supporting bracket.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.