Apparatus and method for providing an inerting gas during soldering
US8220699B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2011 |
| Grant date | Jul 17, 2012 |
| Priority date | — |
| Expiry date | Mar 4, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K3/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an apparatus that is placed atop of a solder reservoir and comprises a plurality of porous tubes that are in fluid communication with an inerting gas. In another aspect, there is provided a method for providing an inerting gas to a wave soldering apparatus comprising the steps of, among other things, placing an apparatus atop at least one edge of the solder reservoir wherein the apparatus comprises a plurality of tubes comprising one or more openings in fluid communication with an inerting gas source. In a further aspect, at least one of the tubes comprises a non-stick coating or is comprised of a porous non-stick material such as a sleeve.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.