Method for post-manufacturing data transfer to and from a sealed device
US8220718B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2008 |
| Grant date | Jul 17, 2012 |
| Priority date | — |
| Expiry date | Jan 5, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The present invention is directed towards authentication tokens that are completely embedded in a non-conductive enclosure. The invention is based on the insight that it would be advantageous to separate the electronic data personalization of such tokens from the visual device personalization. The present application concerns an authentication token that allows communication with an external unit after the production of the nonconductive enclosure, in order to transmit or receive device identification data. As this communication need only take place during the manufacturing process, a low-power close-range transmission technique such as inductive coupling, capacitive coupling, or RFID communication suffices for this purpose. Accordingly, the present application discloses a method for manufacturing authentication tokens, and a token manufactured according to said method.teh
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.