Heat dissipation assembly for an LED downlight
US8220970B1 · kind B1 · utility
164Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 11, 2009 |
| Grant date | Jul 17, 2012 |
| Priority date | — |
| Expiry date | Oct 20, 2029 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF21V29/78
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A heat dissipation assembly for an LED downlight, comprises an LED printed circuit board assembly having a first surface, a second surface and a plurality of LEDs on one of the first surface and the second surface, the LED printed circuit board assembly engaging a primary reflector on a second surface, wherein the LED printed circuit board assembly transfer thermal energy in a first mode to the heat sink and in a second mode to the primary reflector.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.