Housing comprising a housing underpart and method for emitting electromagnetic radiation
US8220973B2 · kind B2 · utility
7Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 26, 2008 |
| Grant date | Jul 17, 2012 |
| Priority date | — |
| Expiry date | Jan 26, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/855
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A housing includes a housing underpart, the housing underpart being provided with a housing cavity. The housing cavity comprises an opening on one housing side and, on the floor of the cavity, contains an electromagnetic radiation emitting semiconductor chip. A cover that is at least partially transparent to the electromagnetic radiation covers the housing cavity. A method for emitting electromagnetic radiation in a preferred direction is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.