Hotmelt adhesive with improved adhesion

US8222336B2 · kind B2 · utility

Assignee

• Henkel AG & Co. KGaA · DE

Inventors

• Ralf Eberhardt · Aalen, DE
• Gunter Hoffmann · Hofheim, DE
• Katja Strauss · Trier, DE
• Ralf Grauel · Hilden, DE
• Richard Scholta
• Volker Kels · Neuss, DE
• Dirk Kasper · Goldkronach, DE

Key dates

• Filing date: Feb 23, 2009
• Grant date: Jul 17, 2012
• Expiry date: Oct 15, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31993
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The invention relates to a hotmelt adhesive based on at least one ethylene and/or propylene/C4 to C20 α-olefin copolymer obtainable by metallocene-catalysed polymerization, on at least one tackifying resin, and on at least 0.1% to 15% by weight of a copolymer or terpolymer based on C2 to C5 olefins with (meth)acrylic esters of low molecular mass alkanols, the copolymer containing COOH groups or anhydride groups, and also, if desired, on wax and additives, and to its use for bonding finished substrate surfaces.