Wiring substrate
US8222536B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 26, 2008 |
| Grant date | Jul 17, 2012 |
| Priority date | — |
| Expiry date | Mar 13, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09709
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wiring substrate is provided with a substrate, a conductive circuit formed on a surface of the substrate, and an insulating layer which covers the conductive circuit. In a fitting portion of the wiring substrate, the insulating layer is formed with an opening portion through which a portion of the conductive circuit is exposed or displayed as an exposed surface. On the exposed surface of the conductive circuit, an electrode layer is formed which is made of a conductive member. A bottom surface of the electrode layer is connected to the conductive circuit. An upper surface of the electrode layer is extended in the widthwise direction W of wirings of the conductive circuit so as to cover even a part of the insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.