Patent · US Active

Bond pad with integrated transient over-voltage protection

US8222698B2 · kind B2 · utility

55Cited by
14References
28Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 12, 2010
Grant dateJul 17, 2012
Priority date—
Expiry dateJan 16, 2031

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D84/138
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

In various embodiments, the invention relates to bond pad structures including planar transistor structures operable as over-voltage clamps.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.