Integrated circuit suitable for use in radio receivers
US8222721B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2003 |
| Grant date | Jul 17, 2012 |
| Priority date | — |
| Expiry date | Nov 10, 2027 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit (500) includes a semiconductor substrate (400) and an integrated circuit package (530). The semiconductor substrate (400) has a first pair of bonding pads (442, 444) conducting a differential output signal thereon and adapted to be coupled to an input of a first external filter, and a second pair of bonding pads (452, 454) conducting a differential input signal thereon and adapted to be coupled to an output of said first external filter. The integrated circuit package (530) encapsulates the semiconductor substrate (400) and has first (452, 454) and second (552, 554) terminal pairs corresponding and coupled to the first (442, 444) and second (452, 454) pairs of bonding pads, respectively. The first (452, 454) and second (552, 554) terminal pairs are separated by a first predetermined distance is sufficient to maintain an input-to-output isolation therebetween of at least a first predetermined amount.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.