Electric module having a conductive pattern layer

US8222723B2 · kind B2 · utility

Assignee

• Imbera Electronics Oy · FI

Inventors

• Risto Tuominen · Espoo, FI
• Petteri Palm · Regensburg, DE

Key dates

• Filing date: Feb 3, 2010
• Grant date: Jul 17, 2012
• Expiry date: Aug 8, 2030

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2201/0355
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An electronic module including a conductive-pattern layer; an insulating-material layer supporting the conductive-pattern layer; and at least one component inside the insulating-material layer is disclosed. The component includes a first surface and contact zones on the first surface. The electronic module further includes a first hardened adhesive layer on the first surface of the component; a second hardened adhesive layer in contact with the conductive-pattern layer and the first hardened adhesive layer; holes in the first and second hardened adhesive layer at the locations of the contact zones; and conductive material in the holes and in electrical connection with the contact zones of the component and the conductive-pattern layer.