Medical device packaging system

US8224447B2 · kind B2 · utility

Assignee

• Medtronic, Inc. · US

Inventors

• William K. Wenger · Weehawken, US
• Paul G. Krause · St. Louis Park, US
• William J. Plombon · Coon Rapids, US
• Steven Lu · Burlington, US
• Sean McAdams · Scottsdale, US
• Brian B. Lee · Golden Valley, US
• Lee Stylos · Stillwater, US
• Judy B. Salzer · Coon Rapids, US
• G. Jordan Montgomery · Blaine, US

Key dates

• Filing date: Nov 30, 2005
• Grant date: Jul 17, 2012
• Expiry date: Oct 6, 2028

Classification

• Technology area (CPC A): Human Necessities
• CPC primary: A61N2001/37294
• WIPO field: Medical technology
• WIPO sector: Instruments

Abstract

A system, comprising a sterilizable package; an implantable medical device placed inside the sterilizable package; and an electrical interface electrically coupled to the implantable medical device and extending from inside the sterilizable package to outside the sterilizable package. In various embodiments, the interface may include package contacts electrically coupled to electrode terminals on the implantable medical device, patient terminals and conductors extending between the package contacts and the patient terminals.