Statistical integrated circuit package modeling for analysis at the early design age
US8225258B2 · kind B2 · utility
0Cited by
2References
18Claims
0Family size
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Key dates
| Filing date | Jun 11, 2009 |
| Grant date | Jul 17, 2012 |
| Priority date | — |
| Expiry date | Aug 19, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In designing an integrated circuit on a die having a set of die bumps, a method to generate a set of lumped circuit parameter values associated with the set of die bumps, based upon distances between the set of die bumps and the center of the die, the method also based upon a sample-data distribution function of a die bump distance variable and a sample-data distribution function of a lumped circuit parameter variable. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.