Patent · US Active

Method for manufacturing a circuit board structure, and a circuit board structure

US8225499B2 · kind B2 · utility

2Cited by

78References

22Claims

0Family size

Assignee

Imbera Electronics Oy · FI

Inventors

Risto Tuominen · Espoo, FI
Antti Iihola · Helsinki, FI
Petteri Palm · Regensburg, DE

Key dates

Filing date	Jun 16, 2006
Grant date	Jul 24, 2012
Priority date	—
Expiry date	Aug 19, 2028

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49146
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

This publication discloses a method for manufacturing a circuit-board structure.1. The structure comprises a conductor pattern (3) and at least one component (6), which is surrounded by an insulating-material layer (10), attached to it by means of a contact bump (5). According to the invention, the contact bumps (5) are made on the surface of the conductor pattern (3), before the component (6) is attached to the conductor pattern (3) by means of the contact bump (5). After attaching, the component (6) is surrounded with an insulating-material layer (10).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.