Three-dimensional wiping substrate and method therefor
US8225729B2 · kind B2 · utility
4Cited by
103References
6Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 16, 2008 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Mar 1, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24033
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
A planar substrate has a moisture activated shrinking filament applied thereon. When wetted, the shrinking filament shrinks and causes the planar substrate to gather and pucker. The planar substrate with the filament thereon may be compressed into a compact shape when in a dry state.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.