Heat dissipation device with heat pipe and elastic member
US8225847B2 · kind B2 · utility
3Cited by
14References
16Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Mar 4, 2009 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Mar 16, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device cooling an electronic device includes a conductive plate, a heat spreader received in the conductive plate and contacting the electronic device, a heat pipe connecting the conductive plate and the heat spreader, and an elastic member mounted on the conductive plate and pushing the heat spreader and the heat pipe in the heat spreader downwardly toward the electronic device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.