Connector with improved manufacturability
US8226441B2 · kind B2 · utility
86Cited by
9References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2009 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Sep 9, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R2107/00
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An I/O connector has a housing that contains a plurality of individual terminal wafers containing terminal dedicated to either ground signals or differential signals. The terminals are arranged in widthwise order to define broadside coupled differential signal terminal pairs. The ground terminals are wider than the signal terminals to provide shielding to the differential signal pairs. The body portions of the ground terminals include pairs of opposed notches that provide for increased retention of the ground terminals in the wafer and provide increased flow for molding material during the formation of the wafers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.