Method for polyurethane bonding during and after overmolding
US8226872B2 · kind B2 · utility
5Cited by
9References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 18, 2010 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Aug 15, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/24
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An electrical apparatus according to the present disclosure comprises a molded device having a molded portion and being formed via an overmolding process. The electrical apparatus includes a wire set at least partially overmolded within the device, the wire set having an outer sheath surrounding a plurality of wires. The molded portion surrounds a portion of the wire set. The electrical apparatus further includes polyurethane bonding material occurring between the outer sheath and the molded portion. The polyurethane bonding material bonds at least a portion of the wire set to the molded portion during the overmolding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.