Manufacture of light emitting devices with phosphor wavelength conversion
US8227269B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 2010 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Jan 25, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of manufacturing a light emitting device comprises: a) depositing over substantially the entire surface of a LED diode wafer having an array of LEDs formed on a surface thereof a mixture of at least one phosphor material and a polymer material, wherein the polymer material is transmissive to light generated by the LEDs and to light generated by the at least one phosphor material; b) mechanically stamping the phosphor/polymer mixture with a stamp having features configured such as to form passages in the phosphor/polymer corresponding to electrode contact pads of each LED thereby enabling access to each electrode contact pad; c) curing the polymer; d) removing the stamp; and e) dividing the LED wafer into individual light emitting devices. The stamp comprises a dissolvable material (polyvinyl alcohol) and the stamp is removed by dissolving it using a solvent (e.g. water).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.