Manufacture of light emitting devices with phosphor wavelength conversion
US8227276B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | May 19, 2010 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Jan 20, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/857
Abstract
A method of manufacturing a light emitting device comprises: depositing over substantially the entire surface of a LED wafer having a array of LEDs formed on a surface thereof a mixture of at least one phosphor and a polymer material, wherein the polymer material is transmissive to light generated by the LEDs and to light generated by the at least one phosphor material; using laser ablation to selectively make apertures in the phosphor/polymer material corresponding to electrode contact pads of each LED thereby enabling access to each electrode contact pad; and dividing the wafer into individual light emitting devices. The method can further comprise, prior to dividing the wafer, cutting slots in the phosphor/polymer material which are configured to pass between individual LEDs. The slots are configured such that a layer of phosphor/polymer material remains on the edges of each LED after division of the wafer into individual light emitting devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.