Printed circuit board
US8227699B2 · kind B2 · utility
5Cited by
3References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 25, 2008 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Nov 21, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09727
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board includes a base insulating layer, first to third signal lines, a first cover insulating layer and a conductive layer. Wide parts are formed in the first to third signal lines. The first cover insulating layer is provided on the base insulating layer so as to cover the wide parts. The conductive layer is provided on the first cover insulating layer so as to cover a portion above the wide parts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.