Moving enclosures for laser equipment
US8227725B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2006 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Apr 24, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T483/115
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Moving enclosures for laser equipment are provided. A machine tool installation is disclosed including (a) a laser cutting head configured to be movable in three dimensions; (b) a workpiece support configured to support a workpiece in operative relationship with the laser cutting head (c) a skirt configured to surround the laser cutting head on three sides and intercept light that passes from the head and is reflected off of the workpiece or workpiece support; and (d) a protective cover positioned to intercept light that is reflected off of the workpiece or workpiece support and is not intercepted by the skirt. The skirt and protective cover are configured to move laterally with the laser cutting head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.