Patent · US Active

Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component

US8227821B2 · kind B2 · utility

4Cited by

11References

11Claims

0Family size

Assignee

OSRAM Opto Semiconductors GmbH · DE

Inventors

Georg Bogner · Lappersdorf, DE
Herbert Brunner · Sinzing, DE
Michael Hiegler · Regensburg, DE
Gunter Waitl · Regensburg, DE

Key dates

Filing date	Sep 20, 2005
Grant date	Jul 24, 2012
Priority date	—
Expiry date	Oct 11, 2027

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/8506

Abstract

A housing for an optoelectronic component which includes a carrier with a chip mounting surface is disclosed. An optical element which is produced separately from the carrier is applied to the carrier. The chip mounting surface and the optical element define a parting plane, the parting plane between carrier and optical element being arranged in the plane of the chip mounting surface. Also disclosed is an optoelectronic component having a housing of this type and a method for producing an optoelectronic component of this type.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.