LED array package covered with a highly thermal conductive plate
US8227828B2 · kind B2 · utility
6Cited by
0References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2010 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Dec 1, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A light source includes a substrate, a light emitting diode on the substrate, and a phosphor layer over the light emitting diode. A plate is on the phosphor layer. An attachment member is coupled to the plate and is configured to conduct heat away from the plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.