Sensor element and process for assembling a sensor element
US8228160B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 2009 |
| Grant date | Jul 24, 2012 |
| Priority date | — |
| Expiry date | Sep 8, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49099
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A high-temperature sensor element includes at least one thermistor element having at least two contact areas and one contacting element including an isolating ceramic base body and at least two conductor lines. The contact areas of the thermistor element are connected to the conductor lines of the contacting element by an electro conductive bridge. A process for assembling a sensor element is also described in which an thermistor element is connected by a temperature resistant junction to a contacting element, and in which the thermistor element and part of the contacting element adjacent to the thermistor element are sealed by a encapsulation compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.