Overmolded circuit board and method
US8230575B2 · kind B2 · utility
12Cited by
251References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2008 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Sep 14, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electrical device includes a circuit board having one or more electrical components mounted to the circuit board. At least a portion of the circuit board is encapsulated in a thermoplastic polymer material to encapsulate the electrical components. The device may be fabricated by at least partially shielding the electrical components with polymer material, followed by overmolding the polymer material with thermoplastic polymer material. The shielding material may comprise a pre-formed component, or it may comprise thermoplastic polymer material that is molded around the electrical components in a first molding step or “shot”.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.