Elevated temperature forming die apparatus
US8230713B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 30, 2008 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Apr 8, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An elevated temperature forming die apparatus comprising a lower die part having a first upper surface positioned to engage a lower surface of a first region of such a workpiece, an upper die part supported for reciprocal motion relative to the lower die part, the upper die part having a lower surface that engages an upper surface of a second region of a sheet material workpiece, heaters in thermal communication with the die parts, and a third die part having an upper surface that engages a lower surface of the second region of a sheet material workpiece whose first portion is positioned between the upper and lower die parts, the third die part being supported for reciprocal motion relative to the upper die part such that closure of the upper die part along the first stroke portion against the third die part will clamp the first portion of the workpiece between the upper and third die parts, and the third die part being supported for reciprocal motion relative to the lower die part such that, once the first portion of a workpiece has been clamped between the upper and third die parts a draw region of the workpiece extending adjacent an interface between the first and second portion…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.