Heat dissipation device having a fan duct thereon
US8230904B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | May 27, 2009 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Oct 23, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipation device includes a heat sink, a fan placed on a top of the heat sink for providing an airflow through the heat sink and a fan duct located at a side of the heat sink. The heat sink includes a plurality of upwardly extending first fins and a plurality of laterally extending second fins located below the first fins. A plurality of first airflow channels are defined in the adjacent first fins and a plurality of second airflow channels are defined in the adjacent second fins. The fan duct guides a significant part of the airflow produced by the fan to the second airflow channels from a lateral side of the heat sink to have a sufficient contact with the second fins of the heat sink.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.