Methods to recover and purify silicon particles from saw kerf
US8231006B2 · kind B2 · utility
2Cited by
19References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2009 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Jun 8, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/10
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
The present disclosure generally relates to methods for recovering silicon from saw kerf, or an exhausted abrasive slurry, resulting from the cutting of a silicon ingot, such as a single crystal or polycrystalline silicon ingot. More particularly, the present disclosure relates to methods for isolating and purifying silicon from saw kerf or the exhausted slurry, such that the resulting silicon may be used as a raw material, such as a solar grade silicon raw material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.