System and method for controlling impedance in a flexible circuit
US8231390B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 18, 2010 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Oct 14, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09481
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit is provided. The flexible circuit includes a circuit board mating end and a flexible body extending from the circuit board mating end. A conductive pathway extends through the flexible body to electrically couple circuit boards. A connector pad is positioned on the circuit board mating end. The conductive pathway electrically engages the connector pad. The connector pad is configured to electrically couple the flexible circuit to one of the circuit boards. A layer of uncured material extends between the connector pad and the conductive pathway. The layer of uncured material increases an impedance of the connector pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.