Sensor interconnect system
US8231414B2 · kind B2 · utility
1Cited by
23References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2005 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Mar 2, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10265
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An interconnect subsystem having a sensor, at least one substrate, at least one contact assembly to said sensor and said substrate, and optionally a registration pin connected to said sensor and passing through said substrate. The contact assembly includes a guide tube, a spring within the guide tube, and a transmission tube having a contact surface and at least partially within the guide tube and forced outward by the spring, such that the contact surface contacts conductive pads on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.