Method of making sub-surface photoalterations in a material
US8231612B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 19, 2007 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | May 31, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of photoaltering a material using a pulsed laser beam includes selecting a first pulse energy and a first focal point separation based on a relationship of pulse energy and focal point separation combinations enabling layer separation of the material by photoalteration, and scanning the pulsed laser beam along a scan region at the first pulse energy and the first focal point separation. The relationship has a slope and has a distinct change in the slope. The distinct change in the slope is associated with a second pulse energy of the relationships and the first pulse energy is equal to or less than the second pulse energy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.