Aqueous stripping and cleaning composition
US8231733B2 · kind B2 · utility
5Cited by
27References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 2005 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | May 27, 2025 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S134/902
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a method used to remove post etch organic and inorganic residue as well polymeric residues and contaminants from semiconductor substrates. In one aspect, the method involves contacting the substrate with a composition are comprised of a water soluble organic solvent, a sulfonic acid and water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.