Sputtering target and method of fabrication
US8231745B2 · kind B2 · utility
10Cited by
11References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2011 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Jun 27, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12243
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A process is described for processing metal which includes clock rolling a metal plate until the desired thickness is achieved to form a rolled plate. Sputtering targets and other metal articles are further described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.