Process for making resilient pad composite
US8231756B2 · kind B2 · utility
32Cited by
33References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Apr 12, 2010 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Apr 12, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24851
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present application discloses a composite pad structure that includes a substrate bonded to a plurality of discrete, spaced-apart, resilient elements engaged to at least one reinforcing structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.