Percolation efficiency of the conductivity of electrically conductive adhesives
US8231808B2 · kind B2 · utility
1Cited by
5References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 22, 2009 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Jun 23, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2998
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An electroconductive bonding material is formed as a Modified Electrically Conductive Adhesive (MECA), and consists of a resin matrix and a modified conductive filler. The resin matrix if formed by providing a thermosetting or thermoplastic resin-based polymer resin. The conductive filler is a metal filler material suitable for use as conductive filler for the resin matrix. The metal filler is modified by applying a material selected from one of halogens, pseudohalogens or their precursors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.