Method and apparatus for accurately applying structures to a substrate
US8231931B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 2005 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Jun 12, 2027 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method wherein a substrate is provided, wherein, in a scanning step, structures already applied to the substrate are detected by at least one scanning provision of a processing head, wherein the processing head is provided with at least one lighting provision, which lighting provision locally lights the applied lacquer structure in a lighting step by using the information obtained with the scanning step. Further, the invention discloses an apparatus for carrying out the method is described, which apparatus is provided with a processing head which is movable relative to a substrate carrier, wherein the processing head comprises at least one scanning provision and at least one lighting provision.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.