Patent · US Active

Via and method of via forming and method of via filling

US8232626B2 · kind B2 · utility

4Cited by

3References

22Claims

0Family size

Assignee

Hong Kong Applied Science and Technology Research Institute Company Limited · CN

Inventors

Yat Kit Tsui · Sha Tin, CN
Dan Yang · Nanhu, CN
Xunqing Shi · Sha Tin, CN

Key dates

Filing date	Jun 14, 2010
Grant date	Jul 31, 2012
Priority date	—
Expiry date	Feb 9, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/1461
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An electronic or micromechanical device having first (11) and second (12) surfaces and a via extending through the device from the first surface to the second surface. The via comprises integrally formed first (84, 86), second (82) and third (88) portions. The first portion (84, 86) extends from the first surface (11) to the second surface (12). The second portion (82) extends over a part of the first surface (11) of the device. The third portion (88) extends over a part of the second surface (12) of the device. Preferably the first portion comprises first and second parts, the second part extending through an active region of the device and having a narrower width than the first part. A method of forming and filling the via is also disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.