Thermal transfer and acoustic matching layers for ultrasound transducer
US8232705B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 9, 2010 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Jul 9, 2030 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B1/067
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Ultrasound transducers and methods of making ultrasound transducers with improved thermal characteristics are provided. An ultrasound transducer can include: a backing, a piezoelectric element attached to the backing, a first matching layer attached to the piezoelectric element, and a second matching layer attached to the first matching layer. The first matching layer can comprise metal and can have a thermal conductivity of about greater than 30 W/mK. The second matching layer can have a thermal conductivity of about 0.5-300 W/mK. The first matching layer can have an acoustic impedance of about 10-20 MRayl, and the second matching layer can have a lower acoustic impedance. The first matching layer can be thicker than the second matching layer. The ultrasound transducer can include a lens and a matching layer disposed between the piezoelectric element and the lens can be configured to conduct heat from the piezoelectric element to the backing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.