Composite organic encapsulants
US8233261B2 · kind B2 · utility
2Cited by
3References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2007 |
| Grant date | Jul 31, 2012 |
| Priority date | — |
| Expiry date | Aug 16, 2028 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1126
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns a fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.