Semiconductor element chip, ink jet head employing semiconductor element chip, and method for bonding electrodes of semiconductor element chip
US8235503B2 · kind B2 · utility
0Cited by
2References
3Claims
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Key dates
| Filing date | Dec 2, 2008 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Apr 9, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor element substrate includes an electrode pad; a semiconductor element; and a connection heater for heating the electrode pad, wherein the connection heater is disposed in a range capable of heating the electrode pad up to a level capable of electrical connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.