Adhesive materials, adhesive parts formed therewith and their uses
US8236128B2 · kind B2 · utility
10Cited by
50References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 12, 2007 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Nov 15, 2029 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J163/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Adhesive material and adhesive parts are formed according to the present invention along with used therefore. The adhesive parts typically include a handling layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.