Deposition system
US8236152B2 · kind B2 · utility
2Cited by
29References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 24, 2006 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Apr 12, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3423
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A deposition system includes a chamber, a plurality of targets in a center region in the chamber and a plurality of substrates in the chamber. The targets are sequentially positioned when viewed in a first direction. At least one of the targets includes a sputtering surface facing outward. The substrates are sequentially positioned when viewed in the first direction. At least one of the substrates includes a deposition surface configured to receive material sputtered off the sputtering surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.