Foundry compatible process for manufacturing a magneto meter using lorentz force for integrated systems
US8236577B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 14, 2011 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Feb 6, 2031 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01C17/28
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for fabricating an integrated electronic compass and circuit system. The fabrication method begins with providing a semiconductor substrate comprising a surface region. One or more CMOS integrated circuits are then formed on one or more portions of the semiconductor substrate. Once the CMOS circuits are formed, a thickness of dielectric material is formed overlying the one or more CMOS integrated circuits. A substrate is then joined overlying the thickness of the dielectric material. Once joined, the substrate is thinned to a predetermined thickness. Following the thinning process, an electric compass device is formed within one or more regions of the predetermined thickness of the substrate. Other mechanical devices or MEMS devices can also be formed within one or more regions of the thinned substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.