Twin-chip-mounting type diode
US8237065B2 · kind B2 · utility
2Cited by
1References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 25, 2008 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Dec 15, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a diode that does not deteriorate its function even if it is used in an environment where the temperature change is considerable, such as in a terminal box for solar cell panel that is placed outdoors. A diode of twin-chip-mounting type in which each chip has a lead foot for being joined to a common terminal plate, wherein said lead feet are electrically connected with each other in a region of each lead foot from each chip to a portion wherein each lead foot is joined. The electrical connection of the lead feet is preferably formed by integral molding with each lead foot.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.