Method and apparatus for laser drilling holes with Gaussian pulses
US8237080B2 · kind B2 · utility
3Cited by
13References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2008 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Jan 27, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An improved method and apparatus for drilling tapered holes in workpieces with laser pulses is presented which uses defocused laser pulses to machine the holes with specified taper and surface finish while maintaining specified exit diameters and improved system throughput. A system is described which can also drill holes with the desired taper and surface finish without requiring defocused laser pulses.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.