Patent · US Active

Method for producing a hole

US8237082B2 · kind B2 · utility

7Cited by

13References

27Claims

0Family size

Assignee

Siemens Aktiengesellschaft · DE

Inventors

Thomas Beck · Catonsville, US
Silke Settegast · Berlin, DE

Key dates

Filing date	Jan 5, 2007
Grant date	Aug 7, 2012
Priority date	—
Expiry date	Dec 7, 2028

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K26/389
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

There is described a method for producing a hole using e.g. a lasers, wherein short laser pulse durations are used. The laser pulse durations are varied, short laser pulse durations being utilized only in the area to be removed in which an influence on the penetration behavior and discharge behavior is noticeable while longer pulse durations of >0.4 ms are used. This is the case for the inner surface of a diffuser of a hole, for example, which can be produced very accurately by means of short laser pulse durations.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.