Heat-curable silicone resin-epoxy resin composition, and premolded package molded from same
US8237189B2 · kind B2 · utility
2Cited by
5References
5Claims
0Family size
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Key dates
| Filing date | Jul 1, 2009 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Oct 18, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat-curable silicone resin-epoxy resin composition that is ideal as a premolded package for a high-brightness LED or solar cell. The composition contains (A) a heat-curable silicone resin, (B) a combination of a triazine derivative epoxy resin and an acid anhydride, or a prepolymer obtained by reaction of them, (C) an inorganic filler, and (D) a curing accelerator. The composition exhibits excellent curability, and yields a uniform cured product that displays excellent retention of heat resistance and light resistance over long periods of time, and suffers minimal yellowing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.