Image sensor and method for manufacturing the same
US8237833B2 · kind B2 · utility
0Cited by
3References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 27, 2009 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Aug 9, 2030 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided are an image sensor and a method for manufacturing the same. The image sensor comprises: a readout circuitry, an interconnection, a contact plug, and an image sensing device. The readout circuitry is formed in a first substrate. The interconnection is electrically connected to the readout circuitry over the first substrate. The contact plug is formed over the interconnection, and includes an insulating layer at regions in an upper side thereof. The image sensing device is formed over the contact plug.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.