In-molded capacitive sensors
US8238073B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 18, 2008 |
| Grant date | Aug 7, 2012 |
| Priority date | — |
| Expiry date | Jun 7, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49105
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
In a method for forming an in-molded capacitive sensing device a plastic film is provided, the plastic film comprising a first side and a second side. A capacitive sensor pattern is disposed on at least a portion of the second side, the capacitive sensor pattern including a region for facilitating electrical contact. A resin layer is printed over a portion of the capacitive sensor pattern such that access to the region for facilitating electrical contact is maintained. A plastic layer is injection molded onto a portion of the resin layer such that the capacitive sensor pattern becomes in-molded between the plastic film and the plastic layer while access to the region for facilitating electrical contact is maintained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.